High-Speed Connector Dynamics: Balancing EMI Shielding and Thermal Cooling Optimization
Data center I/O is experiencing significant fundamental changes. The rise of disaggregation, which separates the traditional all-in-one server into individual resources, has led to a rapidly increased need for intra- and inter-rack communication. When combined with booming data rates from technologies like 5G and AI, designers are encountering new challenges in balancing thermal management and electromagnetic interference (EMI). Learn how to overcome these challenges early in the design process and avoid unnecessary performance loss.