Flex for Fit: How Flexible Printed Circuits Save Space in Harsh Environments

In today’s evolving landscape, it is critical for engineers in both the automotive and industrial sectors to fit more functionality into tight spaces. The rise of new communication protocols is adding complexity while power density and signal integrity are becoming more important design factors. With large investments being made in custom designs, re-use is imperative. This webinar will explore how Flexible Printed Circuits (FPCs) can help meet these modern challenges, as Molex FPC Segment Senior Manager, Ken Stiles, shares insights from his 14 years of design expertise.

What you will learn:

• Space-Saving Techniques: Use FPCs to fit more into less space.
• Handle Protocol Complexity: Gain strategies to manage new communication challenges.
• Enhance Design Metrics: Improve core performance metrics like power density and signal integrity.
• Facilitate Efficient Re-Use: Understand how FPCs support smarter, cost-effective design re-use.

Ken Stiles

Sr. Manager FPC Molex

Ken Stiles has over 25 years of experience in engineering and product development, with 14 years specializing in flexible circuit design. He has held key roles at Molex, including Connector Designer, Field Application Engineer and Engineering Manager. Ken holds a Bachelor of Science degree in Mechanical Engineering from Grove City College, in Grove City, PA and an MBA from the University of Minnesota Duluth.